At CES (Consumer Electronics Show) 2016 in Las Vegas, the giant mobile phone chipset maker Qualcomm was  introduced the first Snapdragon 820 64-bit SoC powered smartphone with Qualcomm Sense ID Fingerprint technology – called the Le Max Pro, manufactured by the Chinese company LeEco (formerly known as Letv). Now the smartphone has been certified by TENAA (China’s certification site). Check out the smartphone specifications below.

"LeEco Le Max Pro"

LeEco Le Max Pro Specifications:

  • 6.33-inch Quad HD (2560 x 1440 pixels) IPS display
  • Qualcomm Snapdragon 820 64-bit SoC with 2.2GHz Quad-Core CPU
  • Adreno 530 GPU
  • 64GB internal storage
  • Android 6.0 (Marshmallow) with EUI
  • Dual SIM (dual stand-by)
  • 4G LTE Cat 12/13 with VoLTE, Tri-band Wi-Fi 802.11ad 2×2 MU-MIMO, Bluetooth 4.1 with APT-X, A-GPS/GLONASS/BDS, NFC, microUSB 2.0 Type C, MHL 3.0, USB OTG, Wireless HDMI
  • 3.5mm audio jack, LeHiFi sound, AKG Audio chip
  • 21-megapixel phase-detection auto-focus (PDAF) rear camera with dual-tone LED flash, Sony IMX230 Sensor, OIS (Optical image stabilization), F/2.0 aperture, dual ISP support, 4K video recording
  • 4-megapixel front camera with OmniVision OV4688 sensor, 81.6-degree wide-angle lens, 1080p video recording
  • Qualcomm Sense ID Fingerprint reader
  • 3400mAh battery with Quick charge 3.0
  • Dimensions: 167.1 × 83.5 × 8.95mm
  • Weight: 204 grams

The price of the Le Max Pro is expected to be around $535. Since the smartphone has now been certified, we can expect it to go on sale in the Chinese market soon.

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